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AI chip stocks, ranked by AI-chain exposure

The companies that design, manufacture and equip the silicon AI runs on - GPUs, HBM, advanced packaging and the foundry tools behind them.

260 companies · ranked by chain-weight

  1. 1NVIDIA logoNVIDIANVDAvia GPU85chain wt
  2. 2TSMC logoTSMCTSMvia Foundry capacity81chain wt
  3. 3ASE Technology Holding Co., Ltd. logoASE Technology Holding Co., Ltd.ASXvia Packaging capacity81chain wt
  4. 4Ibiden Co., Ltd. logoIbiden Co., Ltd.4062.Tvia Packaging capacity79chain wt
  5. 5Amkor Technology logoAmkor TechnologyAMKRvia Packaging capacity79chain wt
  6. 6SK hynix logoSK hynix000660.KSvia HBM76chain wt
  7. 7Shinko Electric Industries Co., Ltd. logoShinko Electric Industries Co., Ltd.via Packaging capacity72chain wt
  8. 8Advantest Corporation logoAdvantest Corporation6857.Tvia HBM71chain wt
  9. 9ASML logoASMLASMLvia Lithography equipment69chain wt
  10. 10Unimicron Technology Corp. logoUnimicron Technology Corp.3037.TWvia Packaging capacity69chain wt
  11. 11600584JCET Group600584via Packaging capacity69chain wt
  12. 12Samsung Electronics logoSamsung Electronics005930.KSvia HBM67chain wt
  13. 136146.TDisco Corporation6146.Tvia Packaging capacity67chain wt
  14. 14BTBiren Technologyvia GPU67chain wt
  15. 15MetaX Integrated Circuits logoMetaX Integrated Circuitsvia GPU67chain wt
  16. 16AMD logoAMDAMDvia GPU64chain wt
  17. 17Tokyo Electron logoTokyo Electron8035.Tvia Foundry capacity64chain wt
  18. 18BE Semiconductor Industries N.V. logoBE Semiconductor Industries N.V.BESIvia CoWoS / advanced packaging64chain wt
  19. 196239Powertech Technology (PTI)6239via Packaging capacity64chain wt
  20. 20Monolithic Power Systems logoMonolithic Power SystemsMPWRvia GPU63chain wt
  21. 21Moore Threads logoMoore Threadsvia GPU63chain wt
  22. 22SMIC (Semiconductor Manufacturing International Corp.) logoSMIC (Semiconductor Manufacturing International Corp.)0981.HKvia Foundry capacity62chain wt
  23. 23Onto Innovation logoOnto InnovationONTOvia CoWoS / advanced packaging61chain wt
  24. 24Applied Materials logoApplied MaterialsAMATvia Deposition & etch equipment60chain wt
  25. 253661.TWAlchip Technologies, Limited3661.TWvia ASIC60chain wt
  26. 26Micron logoMicronMUvia DRAM59chain wt
  27. 27KLA logoKLAKLACvia Metrology & inspection59chain wt
  28. 28Lam Research logoLam ResearchLRCXvia Deposition & etch equipment58chain wt
  29. 29Synopsys logoSynopsysSNPSvia EDA & design IP58chain wt
  30. 30Cadence Design Systems logoCadence Design SystemsCDNSvia EDA & design IP56chain wt
  31. 31Teradyne logoTeradyneTERvia Test & burn-in capacity56chain wt
  32. 32KLICKulicke & Soffa IndustriesKLICvia Packaging capacity56chain wt
  33. 33Arm logoArmARMvia EDA & design IP55chain wt
  34. 34ASM International N.V. logoASM International N.V.ASM.ASvia Foundry capacity55chain wt
  35. 35MediaTek Inc. logoMediaTek Inc.2454.TWvia ASIC54chain wt
  36. 36Cambricon Technologies logoCambricon Technologies688256.SSvia ASIC54chain wt
  37. 37Hygon Information Technology logoHygon Information Technology688041.SSvia Host compute (server CPUs)54chain wt
  38. 38Socionext Inc. logoSocionext Inc.6526.Tvia ASIC53chain wt
  39. 391347.HKHua Hong Semiconductor1347.HKvia Foundry capacity52chain wt
  40. 40Lasertec logoLasertec6920.Tvia Yield52chain wt
  41. 41AWEAlphawave SemiAWEvia SerDes52chain wt
  42. 42ETEnflame Technologyvia ASIC52chain wt
  43. 43MACOM Technology Solutions logoMACOM Technology SolutionsMTSIvia Photonic components50chain wt
  44. 44BTBitmain Technologiesvia ASIC50chain wt
  45. 45042700.KSHanmi Semiconductor Co., Ltd.042700.KSvia HBM49chain wt
  46. 46Rambus logoRambusRMBSvia EDA & design IP49chain wt
  47. 47CAMTCamtekCAMTvia Yield49chain wt
  48. 48Semtech logoSemtechSMTCvia Photonic components48chain wt
  49. 49M(MicroBT (Shenzhen MicroBT Electronics)via ASIC48chain wt
  50. 50Kioxia Holdings Corporation logoKioxia Holdings Corporation285A.Tvia AI factory47chain wt
  51. 512408.TWNanya Technology Corporation2408.TWvia DRAM47chain wt
  52. 52GlobalFoundries logoGlobalFoundriesGFSvia Silicon photonics46chain wt
  53. 532449King Yuan Electronics (KYEC)2449via Test & burn-in capacity46chain wt
  54. 548150ChipMOS Technologies8150via Test & burn-in capacity46chain wt
  55. 55Infineon Technologies logoInfineon TechnologiesIFXvia Power delivery chain44chain wt
  56. 56Tongfu Microelectronics Co., Ltd. logoTongfu Microelectronics Co., Ltd.002156.SZvia Packaging capacity44chain wt
  57. 57Carl Zeiss SMT logoCarl Zeiss SMTvia Foundry capacity44chain wt
  58. 58Intel logoIntelINTCvia Lithography equipment43chain wt
  59. 59VAT Group AG logoVAT Group AGVACN.SWvia Foundry capacity43chain wt
  60. 60FORMFormFactorFORMvia Test & burn-in capacity43chain wt
  61. 61AMEC (Advanced Micro-Fabrication Equipment Inc.) logoAMEC (Advanced Micro-Fabrication Equipment Inc.)688012.SSvia Foundry capacity42chain wt
  62. 62Winbond Electronics Corporation logoWinbond Electronics Corporation2344.TWvia DRAM42chain wt
  63. 63Technoprobe logoTechnoprobeTPROvia Test & burn-in capacity42chain wt
  64. 64NAURA Technology Group logoNAURA Technology Group002371.SZvia Foundry capacity41chain wt
  65. 65688498.SHYuanjie Semiconductor Technology688498.SHvia Indium phosphide41chain wt
  66. 66Nova logoNovaNVMIvia Yield40chain wt
  67. 67Groq logoGroqvia Inference serving40chain wt
  68. 68MCHPMicrochip TechnologyMCHPvia SerDes39chain wt
  69. 69ASMPT Limited logoASMPT Limited0522.HKvia HBM39chain wt
  70. 70SUSS MicroTec logoSUSS MicroTecSMHN.DEvia Packaging capacity39chain wt
  71. 71CXMT (ChangXin Memory Technologies) logoCXMT (ChangXin Memory Technologies)via DRAM39chain wt
  72. 72SanDisk logoSanDiskSNDKvia NAND & AI storage38chain wt
  73. 733048.TWEDOM Technology Co., Ltd.3048.TWvia GPU38chain wt
  74. 74I(imec (Interuniversity Microelectronics Centre)via Silicon photonics38chain wt
  75. 75GIGigaphoton Inc.via Foundry capacity38chain wt
  76. 76NTNuFlare Technologyvia Photomask & reticle38chain wt
  77. 77Tianshui Huatian Technology Co., Ltd. logoTianshui Huatian Technology Co., Ltd.002185.SZvia Packaging capacity37chain wt
  78. 78Mobileye Global Inc. logoMobileye Global Inc.MBLYvia ASIC37chain wt
  79. 79EGEV Group (EVG)via Packaging capacity37chain wt
  80. 80Tower Semiconductor Ltd. logoTower Semiconductor Ltd.TSEMvia Foundry capacity36chain wt
  81. 81Micronics Japan Co., Ltd. logoMicronics Japan Co., Ltd.6871.Tvia HBM36chain wt
  82. 82TOWA Corporation logoTOWA Corporation6315.Tvia HBM36chain wt
  83. 83STMicroelectronics logoSTMicroelectronicsSTMvia Transceivers35chain wt
  84. 843443.TWGlobal Unichip Corporation3443.TWvia ASIC35chain wt
  85. 85Ultra Clean Holdings, Inc. logoUltra Clean Holdings, Inc.UCTTvia Foundry capacity35chain wt
  86. 86Ichor Holdings, Ltd. logoIchor Holdings, Ltd.ICHRvia Foundry capacity35chain wt
  87. 87SCREEN Holdings logoSCREEN Holdings7735.Tvia Foundry capacity34chain wt
  88. 88AIXTRON logoAIXTRONAIXA.DEvia Indium phosphide34chain wt
  89. 89CACelestial AIvia Optical interconnect34chain wt
  90. 90688008.SSMontage Technology688008.SSvia DRAM33chain wt
  91. 91Piotech Inc. logoPiotech Inc.688072.SSvia Foundry capacity33chain wt
  92. 92067310.KQHana Micron Inc.067310.KQvia Packaging capacity33chain wt
  93. 935274.TWASPEED Technology5274.TWvia Host compute (server CPUs)32chain wt
  94. 94Kokusai Electric Corporation logoKokusai Electric Corporation6525.Tvia Foundry capacity32chain wt
  95. 95COTN.SWComet Holding AGCOTN.SWvia Foundry capacity32chain wt
  96. 96Advanced Energy Industries, Inc. logoAdvanced Energy Industries, Inc.AEISvia Foundry capacity31chain wt
  97. 97ACM Research, Inc. logoACM Research, Inc.ACMRvia Foundry capacity31chain wt
  98. 98Macnica Holdings, Inc. logoMacnica Holdings, Inc.3132.Tvia GPU31chain wt
  99. 99FIFujikin Incorporatedvia Foundry capacity31chain wt
  100. 100SCSEMES Co., Ltd.via Foundry capacity31chain wt
  101. 101039030.KQEO Technics Co., Ltd.039030.KQvia Packaging capacity30chain wt
  102. 102Wolfspeed logoWolfspeedWOLFvia Power delivery chain30chain wt
  103. 103Gudeng Precision Industrial Co., Ltd. logoGudeng Precision Industrial Co., Ltd.3680.TWvia Foundry capacity30chain wt
  104. 104ENEnfabricavia Scale-out fabric30chain wt
  105. 105ALAyar Labsvia CPO30chain wt
  106. 106Texas Instruments logoTexas InstrumentsTXNvia AI buildout risk29chain wt
  107. 107Hwatsing Technology Co., Ltd. logoHwatsing Technology Co., Ltd.688120.SSvia Foundry capacity29chain wt
  108. 108688313.SHHenan Shijia Photons Technology688313.SHvia Photonic components29chain wt
  109. 109688037.SSKingsemi Co., Ltd.688037.SSvia Foundry capacity29chain wt
  110. 110HORIBA, Ltd. logoHORIBA, Ltd.6856.Tvia Foundry capacity29chain wt
  111. 1116323.TRorze Corporation6323.Tvia Foundry capacity29chain wt
  112. 112319660.KQPSK Inc.319660.KQvia Foundry capacity29chain wt
  113. 1134979.TWOLuxNet Corporation4979.TWOvia Indium phosphide29chain wt
  114. 114036540.KQSFA Semicon Co., Ltd.036540.KQvia Packaging capacity29chain wt
  115. 115033640.KQNepes Corporation033640.KQvia Packaging capacity29chain wt
  116. 116TETenstorrentvia ASIC29chain wt
  117. 117LILightmattervia Silicon photonics29chain wt
  118. 118HHHitachi High-Tech Corporationvia Yield29chain wt
  119. 119Brooks Automation, Inc. logoBrooks Automation, Inc.via Foundry capacity29chain wt
  120. 120SiCarrier Technologies logoSiCarrier Technologiesvia Foundry capacity29chain wt
  121. 121SSSJ Semiconductor Corporation (SJSemi)via Packaging capacity29chain wt
  122. 122Analog Devices logoAnalog DevicesADIvia Test & burn-in capacity28chain wt
  123. 123Chroma ATE Inc. logoChroma ATE Inc.2360.TWvia Test & burn-in capacity28chain wt
  124. 124VeriSilicon Microelectronics logoVeriSilicon Microelectronics688521.SSvia ASIC28chain wt
  125. 1252347.TWSynnex Technology International Corporation2347.TWvia GPU28chain wt
  126. 126Cerebras logoCerebrasvia GPU28chain wt
  127. 127Qualcomm logoQualcommQCOMvia Copilot27chain wt
  128. 128002916.SZShennan Circuits Co., Ltd.002916.SZvia Host compute (server CPUs)27chain wt
  129. 1294958.TWZhen Ding Technology Holding Limited4958.TWvia ABF substrates27chain wt
  130. 130688702.SHSuzhou Centec Communications688702.SHvia Switch ASIC27chain wt
  131. 131Biwin Storage Technology logoBiwin Storage Technology688525.SSvia DRAM26chain wt
  132. 132Ebara Corporation logoEbara Corporation6361.Tvia Foundry capacity26chain wt
  133. 133WinWay Technology Co., Ltd. logoWinWay Technology Co., Ltd.6515.TWvia Test & burn-in capacity26chain wt
  134. 134688362.SHForehope Electronic (Ningbo) Co., Ltd.688362.SHvia Packaging capacity26chain wt
  135. 135Axcelis Technologies, Inc. logoAxcelis Technologies, Inc.ACLSvia Foundry capacity26chain wt
  136. 136ULVAC, Inc. logoULVAC, Inc.6728.Tvia Foundry capacity26chain wt
  137. 137Ferrotec Holdings Corporation logoFerrotec Holdings Corporation6890.Tvia Foundry capacity26chain wt
  138. 138UNISEM.KLUnisem (M) BerhadUNISEM.KLvia Packaging capacity26chain wt
  139. 139061970.KQLB Semicon Inc.061970.KQvia Packaging capacity26chain wt
  140. 140UHUTAC Holdings Ltd.via Packaging capacity26chain wt
  141. 141VICRVicor CorporationVICRvia Power delivery chain25chain wt
  142. 142Veeco Instruments logoVeeco InstrumentsVECOvia Foundry capacity25chain wt
  143. 143Pfeiffer Vacuum Technology AG logoPfeiffer Vacuum Technology AGPFV.DEvia Foundry capacity25chain wt
  144. 144Arteris logoArterisAIPvia EDA & design IP25chain wt
  145. 145300604.SZHangzhou Changchuan Technology300604.SZvia Test & burn-in capacity24chain wt
  146. 146Empyrean Technology logoEmpyrean Technology301269.SZvia EDA & design IP24chain wt
  147. 147Tokyo Seimitsu Co., Ltd. (Accretech) logoTokyo Seimitsu Co., Ltd. (Accretech)7729.Tvia Test & burn-in capacity24chain wt
  148. 1483289.TWOIntegrated Service Technology Inc. (iST)3289.TWOvia Test & burn-in capacity24chain wt
  149. 149SSSambaNova Systemsvia ASIC24chain wt
  150. 150Renesas Electronics logoRenesas Electronics6723.Tvia DRAM23chain wt
  151. 151onsemi logoonsemiONvia Power delivery chain23chain wt
  152. 152Leeno Industrial Inc. logoLeeno Industrial Inc.058470.KQvia Test & burn-in capacity23chain wt
  153. 153Ardentec Corporation logoArdentec Corporation3264.TWOvia Test & burn-in capacity23chain wt
  154. 154Navitas Semiconductor logoNavitas SemiconductorNVTSvia Power delivery chain23chain wt
  155. 1556590.TShibaura Mechatronics Corporation6590.Tvia Foundry capacity23chain wt
  156. 156131970.KSTesna Inc. (Doosan Tesna)131970.KSvia Test & burn-in capacity23chain wt
  157. 157XPP.LXP Power LimitedXPP.Lvia Foundry capacity23chain wt
  158. 1583234.TWOTrueLight Corporation3234.TWOvia Transceivers23chain wt
  159. 159Keysight Technologies logoKeysight TechnologiesKEYSvia EDA & design IP22chain wt
  160. 1606223.TWOMPI Corporation6223.TWOvia Test & burn-in capacity22chain wt
  161. 161688048.SHSuzhou Everbright Photonics688048.SHvia Indium phosphide22chain wt
  162. 162INFICON Holding AG logoINFICON Holding AGIFCN.SWvia Yield22chain wt
  163. 1636147.TWOChipbond Technology Corporation6147.TWOvia Packaging capacity22chain wt
  164. 164353200.KSDaeduck Electronics Co., Ltd.353200.KSvia ABF substrates22chain wt
  165. 1656510.TWOChunghwa Precision Test Tech. Co., Ltd.6510.TWOvia Test & burn-in capacity22chain wt
  166. 166Cohu, Inc. logoCohu, Inc.COHUvia Test & burn-in capacity22chain wt
  167. 167Hesai Group logoHesai GroupHSAIvia Robotics control22chain wt
  168. 168AWX.SIAEM Holdings Ltd.AWX.SIvia Test & burn-in capacity22chain wt
  169. 169Ushio Inc. logoUshio Inc.6925.Tvia Foundry capacity22chain wt
  170. 170MPI.KLMalaysian Pacific Industries BerhadMPI.KLvia Packaging capacity22chain wt
  171. 171INARI.KLInari Amertron BerhadINARI.KLvia Packaging capacity22chain wt
  172. 172095340.KQISC Co., Ltd.095340.KQvia Test & burn-in capacity22chain wt
  173. 1732329.TWOrient Semiconductor Electronics, Ltd.2329.TWvia Packaging capacity22chain wt
  174. 1743587.TWOMaterials Analysis Technology Inc. (MA-tek)3587.TWOvia Test & burn-in capacity22chain wt
  175. 175033170.KQSignetics Corporation033170.KQvia Packaging capacity22chain wt
  176. 176603986.SSGigaDevice Semiconductor603986.SSvia DRAM21chain wt
  177. 177688361.SSShenzhen Zhongke Feice Technology (Skyverse)688361.SSvia Foundry capacity21chain wt
  178. 178Phison Electronics logoPhison Electronics8299.TWvia NAND & AI storage21chain wt
  179. 179Horizon Robotics logoHorizon Robotics9660.HKvia ASIC21chain wt
  180. 180Ambarella logoAmbarellaAMBAvia ASIC21chain wt
  181. 181DAIHEN Corporation logoDAIHEN Corporation6622.Tvia Foundry capacity21chain wt
  182. 1826533.TWAndes Technology6533.TWvia EDA & design IP21chain wt
  183. 183S(SMEE (Shanghai Micro Electronics Equipment)via Foundry capacity21chain wt
  184. 184HTHailo Technologiesvia ASIC21chain wt
  185. 185Rebellions logoRebellionsvia ASIC21chain wt
  186. 186XLXsight Labsvia Switch ASIC21chain wt
  187. 187SiFive logoSiFivevia EDA & design IP21chain wt
  188. 188Shenzhen Longsys Electronics logoShenzhen Longsys Electronics301308.SZvia NAND & AI storage20chain wt
  189. 189036930.KQJusung Engineering Co., Ltd.036930.KQvia DRAM20chain wt
  190. 190240810.KQWonik IPS Co., Ltd.240810.KQvia DRAM20chain wt
  191. 1916257.TWSigurd Microelectronics Corporation6257.TWvia Test & burn-in capacity20chain wt
  192. 1923035.TWFaraday Technology3035.TWvia ASIC20chain wt
  193. 193Park Systems Corp. logoPark Systems Corp.140860.KQvia Yield20chain wt
  194. 194089030.KQTechWing, Inc.089030.KQvia Test & burn-in capacity20chain wt
  195. 1956855.TJapan Electronic Materials Corporation6855.Tvia Test & burn-in capacity20chain wt
  196. 196FUFuriosaAIvia ASIC20chain wt
  197. 197D-d-Matrixvia ASIC20chain wt
  198. 198600703.SSSanan Optoelectronics600703.SSvia Indium phosphide19chain wt
  199. 199Oxford Instruments plc logoOxford Instruments plcOXIG.Lvia Photonic components19chain wt
  200. 200SIVE.STSivers Semiconductors ABSIVE.STvia Indium phosphide19chain wt
  201. 201SOPHGO Technologies logoSOPHGO Technologiesvia ASIC19chain wt
  202. 202Graphcore logoGraphcorevia ASIC19chain wt
  203. 203ELEliyanvia SerDes19chain wt
  204. 204688409.SSShenyang Fortune Precision Equipment688409.SSvia Foundry capacity18chain wt
  205. 205300316.SZZhejiang Jingsheng Mechanical & Electrical300316.SZvia Silicon wafer supply18chain wt
  206. 206Silicon Motion Technology logoSilicon Motion TechnologySIMOvia NAND & AI storage18chain wt
  207. 207MaxLinear logoMaxLinearMXLvia 800G optics18chain wt
  208. 208MYCR.STMycronic ABMYCR.STvia Foundry capacity18chain wt
  209. 209PDF Solutions logoPDF SolutionsPDFSvia Yield18chain wt
  210. 2102441.TWGreatek Electronics Inc.2441.TWvia Packaging capacity18chain wt
  211. 211603690.SSPNC Process Systems (Zhichun Technology)603690.SSvia Foundry capacity18chain wt
  212. 212Ceva Inc. logoCeva Inc.CEVAvia EDA & design IP18chain wt
  213. 2135387.TWOFormosa Advanced Technologies Co., Ltd.5387.TWOvia Test & burn-in capacity18chain wt
  214. 214Achronix Semiconductor logoAchronix Semiconductorvia Inference serving18chain wt
  215. 215688200.SSBeijing Huafeng Test & Control Technology688200.SSvia Test & burn-in capacity17chain wt
  216. 216JEOL Ltd. logoJEOL Ltd.6951.Tvia Yield17chain wt
  217. 217Aehr Test Systems logoAehr Test SystemsAEHRvia Test & burn-in capacity17chain wt
  218. 218131290.KQTSE Co., Ltd.131290.KQvia Test & burn-in capacity17chain wt
  219. 219Yamaichi Electronics Co., Ltd. logoYamaichi Electronics Co., Ltd.6941.Tvia Test & burn-in capacity17chain wt
  220. 2206961.TEnplas Corporation6961.Tvia Test & burn-in capacity17chain wt
  221. 221ESEmpower Semiconductorvia Power delivery chain17chain wt
  222. 222Loongson Technology logoLoongson Technology688047.SSvia ASIC16chain wt
  223. 2233036.TWWT Microelectronics Co., Ltd.3036.TWvia Host compute (server CPUs)16chain wt
  224. 224600641.SSWanye Enterprises (Kingstone Semiconductor)600641.SSvia Foundry capacity16chain wt
  225. 2253702.TWWPG Holdings Limited3702.TWvia Host compute (server CPUs)16chain wt
  226. 226Rigaku Holdings Corporation logoRigaku Holdings Corporation268A.Tvia Yield16chain wt
  227. 227Primarius Technologies logoPrimarius Technologies688206.SSvia EDA & design IP16chain wt
  228. 228Black Sesame International Holding logoBlack Sesame International Holding2533.HKvia ASIC16chain wt
  229. 229AOSLAlpha and Omega SemiconductorAOSLvia Power delivery chain16chain wt
  230. 230SEV.VSpectra7 Microsystems Inc.SEV.Vvia Scale-up fabric16chain wt
  231. 231Y(YMTC (Yangtze Memory Technologies)via AI factory16chain wt
  232. 232Axelera AI logoAxelera AIvia ASIC16chain wt
  233. 233SASiMa.aivia ASIC16chain wt
  234. 234Imagination Technologies logoImagination Technologiesvia EDA & design IP16chain wt
  235. 235NENextSiliconvia ASIC16chain wt
  236. 2363529.TWeMemory Technology3529.TWvia EDA & design IP15chain wt
  237. 2373105.TWOWIN Semiconductors Corp.3105.TWOvia Photonic components15chain wt
  238. 238BZAIBlaize HoldingsBZAIvia ASIC15chain wt
  239. 239SITMSiTime CorporationSITMvia Host compute (server CPUs)14chain wt
  240. 240InnoScience (Suzhou) Technology logoInnoScience (Suzhou) Technology2577.HKvia Power delivery chain14chain wt
  241. 241Power Integrations logoPower IntegrationsPOWIvia Power delivery chain14chain wt
  242. 242301095.SZSemitronix (Hangzhou Guangli Microelectronics)301095.SZvia Yield14chain wt
  243. 2436643.TWM31 Technology6643.TWvia EDA & design IP14chain wt
  244. 244PRproteanTecsvia Yield14chain wt
  245. 245ROHM Co., Ltd. logoROHM Co., Ltd.6963.Tvia Power delivery chain13chain wt
  246. 246Rockchip Electronics logoRockchip Electronics603893.SSvia ASIC13chain wt
  247. 247300567.SZWuhan Jingce Electronic Group300567.SZvia Test & burn-in capacity13chain wt
  248. 248688233.SSThinkon Semiconductor Jinzhou688233.SSvia Foundry capacity13chain wt
  249. 249Silvaco Group logoSilvaco GroupSVCOvia EDA & design IP13chain wt
  250. 250INTTinTEST CorporationINTTvia Test & burn-in capacity13chain wt
  251. 251FJFujian Jinhua Integrated Circuit (JHICC)via DRAM13chain wt
  252. 252Iluvatar CoreX logoIluvatar CoreXvia GPU13chain wt
  253. 253Lattice Semiconductor logoLattice SemiconductorLSCCvia Host compute (server CPUs)12chain wt
  254. 254Phytium Technology logoPhytium Technologyvia Host compute (server CPUs)12chain wt
  255. 255KBKandou Busvia SerDes12chain wt
  256. 256688627.SSShenzhen SEICHI Technologies (Jingzhida)688627.SSvia DRAM11chain wt
  257. 257688385.SSShanghai Fudan Microelectronics Group688385.SSvia ASIC11chain wt
  258. 258CNCornelis Networksvia Scale-out fabric11chain wt
  259. 259ETEtchedvia ASIC10chain wt
  260. 260EAEnCharge AIvia ASIC9chain wt

Frequently asked

What are the top ai chip stocks?

By modeled exposure to the AI value chain: NVIDIA, TSMC, ASE Technology Holding Co., Ltd., Ibiden Co., Ltd., Amkor Technology, SK hynix. The full ranked list of 260 names is below.

How are ai chip stocks ranked here?

By chain-weight - each company's exposure to the parts of the AI chain, scaled by how central those parts are and the quality of its role (producer, supplier, consumer). It's a structural read, not a price target.

Which chips company has the most AI-chain exposure?

NVIDIA, most strongly through GPU, with a chain-weight of 85/100.

Other AI stock categories

AI infrastructure stocksAI energy & power stocksAI model companiesAI application stocksAI materials stocksDiversified AI stocks

Chain-weight is an illustrative, order-of-magnitude read from our model of the AI value chain - not investment advice.

as of 2026-08-23Medium confidence model v2.8
All companies