Companies exposed to CoWoS / advanced packaging
The AI stocks the model maps to CoWoS / advanced packaging — part of the chips layer, ranked by how strongly each name is exposed.
22 companies · ranked by exposure
A specific advanced method for placing chips and memory on a shared base.
Full explainer: what CoWoS / advanced packaging is & who makes it →It is the concrete technique behind packaging-capacity limits. When CoWoS / advanced packaging tightens, the companies below are the ones in its path — which is why the model tracks their exposure to it.
The companies, ranked by exposure to CoWoS / advanced packaging
- 1
TSMCTSMProducer92 - 2
BE Semiconductor Industries N.V.BESISupplier90 - 36146.TDisco Corporation6146.TSupplier85
- 4
Onto InnovationONTOSupplier85 - 5
Unimicron Technology Corp.3037.TWSupplier80 - 6
Tokyo Electron8035.TSupplier72 - 7
Amkor TechnologyAMKRSupplier70 - 8I(imec (Interuniversity Microelectronics Centre)R&D70
- 9
MKS InstrumentsMKSISupplier70 - 103661.TWAlchip Technologies, Limited3661.TWIntegrator65
- 11
Ibiden Co., Ltd.4062.TSupplier65 - 12KLICKulicke & Soffa IndustriesKLICSupplier65
- 13
ASE Technology Holding Co., Ltd.ASXSupplier55 - 14
Air LiquideAI.PASupplier50 - 153443.TWGlobal Unichip Corporation3443.TWIntegrator50
- 16600584JCET Group600584Producer50
- 17
Socionext Inc.6526.TIntegrator50 - 18000725.SZBOE Technology Group000725.SZR&D40
- 19GIGigaphoton Inc.Supplier40
- 20
Shinko Electric Industries Co., Ltd.Supplier40 - 21
ASM International N.V.ASM.ASSupplier30 - 22
Henkel AG & Co. KGaAHEN3.DESupplier30
Frequently asked
What are the top CoWoS / advanced packaging stocks?
By modeled exposure to CoWoS / advanced packaging: TSMC, BE Semiconductor Industries N.V., Disco Corporation, Onto Innovation, Unimicron Technology Corp., Tokyo Electron. The full ranked list of 22 names is below.
Which companies make CoWoS / advanced packaging?
The names the model tags as producers or suppliers of CoWoS / advanced packaging: TSMC, BE Semiconductor Industries N.V., Disco Corporation, Onto Innovation, Unimicron Technology Corp., Tokyo Electron.
What is CoWoS / advanced packaging?
A specific advanced method for placing chips and memory on a shared base.
What happens if CoWoS / advanced packaging runs short?
Interposer or substrate shortfalls cap advanced-package output.
Exposure scores are illustrative, order-of-magnitude reads from our model of the AI value chain — not investment advice.