AI chip stocks, ranked by AI-chain exposure
The companies that design, manufacture and equip the silicon AI runs on — GPUs, HBM, advanced packaging and the foundry tools behind them.
260 companies · ranked by chain-weight
- 1
NVIDIANVDAvia GPU88chain wt - 2
TSMCTSMvia Foundry capacity84chain wt - 3
ASE Technology Holding Co., Ltd.ASXvia Packaging capacity84chain wt - 4
Ibiden Co., Ltd.4062.Tvia Packaging capacity82chain wt - 5
Amkor TechnologyAMKRvia Packaging capacity82chain wt - 6
SK hynix000660.KSvia HBM79chain wt - 7
Shinko Electric Industries Co., Ltd.via Packaging capacity75chain wt - 8
Advantest Corporation6857.Tvia HBM74chain wt - 9
Unimicron Technology Corp.3037.TWvia Packaging capacity72chain wt - 10600584JCET Group600584via Packaging capacity72chain wt
- 11
ASMLASMLvia Lithography equipment71chain wt - 12
Samsung Electronics005930.KSvia HBM70chain wt - 136146.TDisco Corporation6146.Tvia Packaging capacity70chain wt
- 14BTBiren Technologyvia GPU69chain wt
- 15
MetaX Integrated Circuitsvia GPU69chain wt - 16
AMDAMDvia GPU66chain wt - 17
Tokyo Electron8035.Tvia Foundry capacity66chain wt - 18
BE Semiconductor Industries N.V.BESIvia CoWoS / advanced packaging66chain wt - 196239Powertech Technology (PTI)6239via Packaging capacity66chain wt
- 20
SMIC (Semiconductor Manufacturing International Corp.)0981.HKvia Foundry capacity65chain wt - 21
Monolithic Power SystemsMPWRvia GPU65chain wt - 22
Moore Threadsvia GPU65chain wt - 23
Onto InnovationONTOvia CoWoS / advanced packaging63chain wt - 24
MicronMUvia DRAM62chain wt - 25
Applied MaterialsAMATvia Deposition & etch equipment62chain wt - 263661.TWAlchip Technologies, Limited3661.TWvia ASIC62chain wt
- 27
KLAKLACvia Metrology & inspection61chain wt - 28
Lam ResearchLRCXvia Deposition & etch equipment60chain wt - 29
SynopsysSNPSvia EDA & design IP60chain wt - 30
Cadence Design SystemsCDNSvia EDA & design IP58chain wt - 31
TeradyneTERvia Test & burn-in capacity58chain wt - 32KLICKulicke & Soffa IndustriesKLICvia Packaging capacity58chain wt
- 33
ArmARMvia EDA & design IP57chain wt - 34
ASM International N.V.ASM.ASvia Foundry capacity57chain wt - 35
MediaTek Inc.2454.TWvia ASIC56chain wt - 36
Cambricon Technologies688256.SSvia ASIC56chain wt - 37
Hygon Information Technology688041.SSvia Host compute (server CPUs)56chain wt - 381347.HKHua Hong Semiconductor1347.HKvia Foundry capacity55chain wt
- 39
Socionext Inc.6526.Tvia ASIC55chain wt - 40
MACOM Technology SolutionsMTSIvia Photonic components54chain wt - 41AWEAlphawave SemiAWEvia SerDes54chain wt
- 42ETEnflame Technologyvia ASIC54chain wt
- 43
Lasertec6920.Tvia Yield53chain wt - 44BTBitmain Technologiesvia ASIC52chain wt
- 45042700.KSHanmi Semiconductor Co., Ltd.042700.KSvia HBM51chain wt
- 46
SemtechSMTCvia Photonic components51chain wt - 47CAMTCamtekCAMTvia Yield51chain wt
- 48688498.SHYuanjie Semiconductor Technology688498.SHvia Indium phosphide50chain wt
- 49
RambusRMBSvia EDA & design IP50chain wt - 50M(MicroBT (Shenzhen MicroBT Electronics)via ASIC50chain wt
- 512408.TWNanya Technology Corporation2408.TWvia DRAM49chain wt
- 52
Kioxia Holdings Corporation285A.Tvia AI factory48chain wt - 53
GlobalFoundriesGFSvia Silicon photonics48chain wt - 542449King Yuan Electronics (KYEC)2449via Test & burn-in capacity48chain wt
- 558150ChipMOS Technologies8150via Test & burn-in capacity47chain wt
- 56
Infineon TechnologiesIFXvia Power delivery chain46chain wt - 57
Tongfu Microelectronics Co., Ltd.002156.SZvia Packaging capacity46chain wt - 58
Carl Zeiss SMTvia Foundry capacity46chain wt - 59
VAT Group AGVACN.SWvia Foundry capacity45chain wt - 60FORMFormFactorFORMvia Test & burn-in capacity45chain wt
- 61
IntelINTCvia Lithography equipment44chain wt - 62
AMEC (Advanced Micro-Fabrication Equipment Inc.)688012.SSvia Foundry capacity44chain wt - 63
Winbond Electronics Corporation2344.TWvia DRAM44chain wt - 64
TechnoprobeTPROvia Test & burn-in capacity44chain wt - 65
NAURA Technology Group002371.SZvia Foundry capacity43chain wt - 66
Groqvia Inference serving42chain wt - 67
NovaNVMIvia Yield41chain wt - 68
ASMPT Limited0522.HKvia HBM41chain wt - 69
AIXTRONAIXA.DEvia Indium phosphide41chain wt - 70
CXMT (ChangXin Memory Technologies)via DRAM41chain wt - 71MCHPMicrochip TechnologyMCHPvia SerDes40chain wt
- 72
SUSS MicroTecSMHN.DEvia Packaging capacity40chain wt - 73I(imec (Interuniversity Microelectronics Centre)via Silicon photonics40chain wt
- 74GIGigaphoton Inc.via Foundry capacity40chain wt
- 75NTNuFlare Technologyvia Photomask & reticle40chain wt
- 76
SanDiskSNDKvia NAND & AI storage39chain wt - 77
Mobileye Global Inc.MBLYvia ASIC39chain wt - 783048.TWEDOM Technology Co., Ltd.3048.TWvia GPU39chain wt
- 79EGEV Group (EVG)via Packaging capacity39chain wt
- 80
Tower Semiconductor Ltd.TSEMvia Foundry capacity38chain wt - 81
Tianshui Huatian Technology Co., Ltd.002185.SZvia Packaging capacity38chain wt - 82
Micronics Japan Co., Ltd.6871.Tvia HBM38chain wt - 83
TOWA Corporation6315.Tvia HBM38chain wt - 84
STMicroelectronicsSTMvia Transceivers37chain wt - 85
Ultra Clean Holdings, Inc.UCTTvia Foundry capacity37chain wt - 86
Ichor Holdings, Ltd.ICHRvia Foundry capacity37chain wt - 873443.TWGlobal Unichip Corporation3443.TWvia ASIC36chain wt
- 884979.TWOLuxNet Corporation4979.TWOvia Indium phosphide36chain wt
- 89
Piotech Inc.688072.SSvia Foundry capacity35chain wt - 90
SCREEN Holdings7735.Tvia Foundry capacity35chain wt - 91CACelestial AIvia Optical interconnect35chain wt
- 92688008.SSMontage Technology688008.SSvia DRAM34chain wt
- 93
Kokusai Electric Corporation6525.Tvia Foundry capacity34chain wt - 94COTN.SWComet Holding AGCOTN.SWvia Foundry capacity34chain wt
- 95067310.KQHana Micron Inc.067310.KQvia Packaging capacity34chain wt
- 965274.TWASPEED Technology5274.TWvia Host compute (server CPUs)33chain wt
- 97
Advanced Energy Industries, Inc.AEISvia Foundry capacity33chain wt - 98
ACM Research, Inc.ACMRvia Foundry capacity33chain wt - 99
Macnica Holdings, Inc.3132.Tvia GPU33chain wt - 100FIFujikin Incorporatedvia Foundry capacity33chain wt
- 101SCSEMES Co., Ltd.via Foundry capacity33chain wt
- 102
Gudeng Precision Industrial Co., Ltd.3680.TWvia Foundry capacity32chain wt - 103ENEnfabricavia Scale-out fabric32chain wt
- 104ALAyar Labsvia CPO32chain wt
- 105688313.SHHenan Shijia Photons Technology688313.SHvia Photonic components31chain wt
- 106039030.KQEO Technics Co., Ltd.039030.KQvia Packaging capacity31chain wt
- 107
WolfspeedWOLFvia Power delivery chain31chain wt - 108
Texas InstrumentsTXNvia AI buildout risk30chain wt - 109
Hwatsing Technology Co., Ltd.688120.SSvia Foundry capacity30chain wt - 110688037.SSKingsemi Co., Ltd.688037.SSvia Foundry capacity30chain wt
- 111
HORIBA, Ltd.6856.Tvia Foundry capacity30chain wt - 1126323.TRorze Corporation6323.Tvia Foundry capacity30chain wt
- 113319660.KQPSK Inc.319660.KQvia Foundry capacity30chain wt
- 114036540.KQSFA Semicon Co., Ltd.036540.KQvia Packaging capacity30chain wt
- 115033640.KQNepes Corporation033640.KQvia Packaging capacity30chain wt
- 116TETenstorrentvia ASIC30chain wt
- 117LILightmattervia Silicon photonics30chain wt
- 118
Brooks Automation, Inc.via Foundry capacity30chain wt - 119
SiCarrier Technologiesvia Foundry capacity30chain wt - 120SSSJ Semiconductor Corporation (SJSemi)via Packaging capacity30chain wt
- 121
Analog DevicesADIvia Test & burn-in capacity29chain wt - 122002916.SZShennan Circuits Co., Ltd.002916.SZvia Host compute (server CPUs)29chain wt
- 123
Chroma ATE Inc.2360.TWvia Test & burn-in capacity29chain wt - 124
VeriSilicon Microelectronics688521.SSvia ASIC29chain wt - 1252347.TWSynnex Technology International Corporation2347.TWvia GPU29chain wt
- 126
Cerebrasvia GPU29chain wt - 127HHHitachi High-Tech Corporationvia Yield29chain wt
- 128
QualcommQCOMvia Copilot28chain wt - 1294958.TWZhen Ding Technology Holding Limited4958.TWvia ABF substrates28chain wt
- 130688702.SHSuzhou Centec Communications688702.SHvia Switch ASIC28chain wt
- 131688048.SHSuzhou Everbright Photonics688048.SHvia Indium phosphide28chain wt
- 132
Veeco InstrumentsVECOvia Foundry capacity28chain wt - 133
Biwin Storage Technology688525.SSvia DRAM27chain wt - 134
Ebara Corporation6361.Tvia Foundry capacity27chain wt - 135
WinWay Technology Co., Ltd.6515.TWvia Test & burn-in capacity27chain wt - 136688362.SHForehope Electronic (Ningbo) Co., Ltd.688362.SHvia Packaging capacity27chain wt
- 137
Axcelis Technologies, Inc.ACLSvia Foundry capacity27chain wt - 138
ULVAC, Inc.6728.Tvia Foundry capacity27chain wt - 139
Ferrotec Holdings Corporation6890.Tvia Foundry capacity27chain wt - 140UNISEM.KLUnisem (M) BerhadUNISEM.KLvia Packaging capacity27chain wt
- 141061970.KQLB Semicon Inc.061970.KQvia Packaging capacity27chain wt
- 142UHUTAC Holdings Ltd.via Packaging capacity27chain wt
- 143VICRVicor CorporationVICRvia Power delivery chain26chain wt
- 144
Pfeiffer Vacuum Technology AGPFV.DEvia Foundry capacity26chain wt - 145
ArterisAIPvia EDA & design IP26chain wt - 146300604.SZHangzhou Changchuan Technology300604.SZvia Test & burn-in capacity25chain wt
- 147
Empyrean Technology301269.SZvia EDA & design IP25chain wt - 148
Tokyo Seimitsu Co., Ltd. (Accretech)7729.Tvia Test & burn-in capacity25chain wt - 1493289.TWOIntegrated Service Technology Inc. (iST)3289.TWOvia Test & burn-in capacity25chain wt
- 1503234.TWOTrueLight Corporation3234.TWOvia Transceivers25chain wt
- 151SSSambaNova Systemsvia ASIC25chain wt
- 152
Renesas Electronics6723.Tvia DRAM24chain wt - 153
onsemiONvia Power delivery chain24chain wt - 154600703.SSSanan Optoelectronics600703.SSvia Indium phosphide24chain wt
- 155
Ardentec Corporation3264.TWOvia Test & burn-in capacity24chain wt - 156
Navitas SemiconductorNVTSvia Power delivery chain24chain wt - 157
Hesai GroupHSAIvia Robotics control24chain wt - 1586590.TShibaura Mechatronics Corporation6590.Tvia Foundry capacity24chain wt
- 159SIVE.STSivers Semiconductors ABSIVE.STvia Indium phosphide24chain wt
- 160131970.KSTesna Inc. (Doosan Tesna)131970.KSvia Test & burn-in capacity24chain wt
- 161XPP.LXP Power LimitedXPP.Lvia Foundry capacity24chain wt
- 162
Keysight TechnologiesKEYSvia EDA & design IP23chain wt - 1636223.TWOMPI Corporation6223.TWOvia Test & burn-in capacity23chain wt
- 164
INFICON Holding AGIFCN.SWvia Yield23chain wt - 1656147.TWOChipbond Technology Corporation6147.TWOvia Packaging capacity23chain wt
- 166353200.KSDaeduck Electronics Co., Ltd.353200.KSvia ABF substrates23chain wt
- 167
Leeno Industrial Inc.058470.KQvia Test & burn-in capacity23chain wt - 1686510.TWOChunghwa Precision Test Tech. Co., Ltd.6510.TWOvia Test & burn-in capacity23chain wt
- 169
Cohu, Inc.COHUvia Test & burn-in capacity23chain wt - 170AWX.SIAEM Holdings Ltd.AWX.SIvia Test & burn-in capacity23chain wt
- 171
Ushio Inc.6925.Tvia Foundry capacity23chain wt - 172MPI.KLMalaysian Pacific Industries BerhadMPI.KLvia Packaging capacity23chain wt
- 173INARI.KLInari Amertron BerhadINARI.KLvia Packaging capacity23chain wt
- 174095340.KQISC Co., Ltd.095340.KQvia Test & burn-in capacity23chain wt
- 1752329.TWOrient Semiconductor Electronics, Ltd.2329.TWvia Packaging capacity23chain wt
- 1763587.TWOMaterials Analysis Technology Inc. (MA-tek)3587.TWOvia Test & burn-in capacity23chain wt
- 177033170.KQSignetics Corporation033170.KQvia Packaging capacity23chain wt
- 178603986.SSGigaDevice Semiconductor603986.SSvia DRAM22chain wt
- 179688361.SSShenzhen Zhongke Feice Technology (Skyverse)688361.SSvia Foundry capacity22chain wt
- 180
Phison Electronics8299.TWvia NAND & AI storage22chain wt - 181
Horizon Robotics9660.HKvia ASIC22chain wt - 182
AmbarellaAMBAvia ASIC22chain wt - 183
DAIHEN Corporation6622.Tvia Foundry capacity22chain wt - 184S(SMEE (Shanghai Micro Electronics Equipment)via Foundry capacity22chain wt
- 185HTHailo Technologiesvia ASIC22chain wt
- 186
Rebellionsvia ASIC22chain wt - 187XLXsight Labsvia Switch ASIC22chain wt
- 188
Shenzhen Longsys Electronics301308.SZvia NAND & AI storage21chain wt - 189036930.KQJusung Engineering Co., Ltd.036930.KQvia DRAM21chain wt
- 190240810.KQWonik IPS Co., Ltd.240810.KQvia DRAM21chain wt
- 1916257.TWSigurd Microelectronics Corporation6257.TWvia Test & burn-in capacity21chain wt
- 192
Oxford Instruments plcOXIG.Lvia Photonic components21chain wt - 1933035.TWFaraday Technology3035.TWvia ASIC21chain wt
- 194
Park Systems Corp.140860.KQvia Yield21chain wt - 1956533.TWAndes Technology6533.TWvia EDA & design IP21chain wt
- 196FUFuriosaAIvia ASIC21chain wt
- 197D-d-Matrixvia ASIC21chain wt
- 198
SiFivevia EDA & design IP21chain wt - 199089030.KQTechWing, Inc.089030.KQvia Test & burn-in capacity20chain wt
- 2006855.TJapan Electronic Materials Corporation6855.Tvia Test & burn-in capacity20chain wt
- 201688409.SSShenyang Fortune Precision Equipment688409.SSvia Foundry capacity19chain wt
- 202300316.SZZhejiang Jingsheng Mechanical & Electrical300316.SZvia Silicon wafer supply19chain wt
- 203
Silicon Motion TechnologySIMOvia NAND & AI storage19chain wt - 204
MaxLinearMXLvia 800G optics19chain wt - 205MYCR.STMycronic ABMYCR.STvia Foundry capacity19chain wt
- 206
PDF SolutionsPDFSvia Yield19chain wt - 2072441.TWGreatek Electronics Inc.2441.TWvia Packaging capacity19chain wt
- 208603690.SSPNC Process Systems (Zhichun Technology)603690.SSvia Foundry capacity19chain wt
- 209
Ceva Inc.CEVAvia EDA & design IP19chain wt - 2105387.TWOFormosa Advanced Technologies Co., Ltd.5387.TWOvia Test & burn-in capacity19chain wt
- 211
SOPHGO Technologiesvia ASIC19chain wt - 212
Graphcorevia ASIC19chain wt - 213ELEliyanvia SerDes19chain wt
- 214
Achronix Semiconductorvia Inference serving19chain wt - 215688200.SSBeijing Huafeng Test & Control Technology688200.SSvia Test & burn-in capacity18chain wt
- 216
Aehr Test SystemsAEHRvia Test & burn-in capacity18chain wt - 217131290.KQTSE Co., Ltd.131290.KQvia Test & burn-in capacity18chain wt
- 218
Yamaichi Electronics Co., Ltd.6941.Tvia Test & burn-in capacity18chain wt - 2196961.TEnplas Corporation6961.Tvia Test & burn-in capacity18chain wt
- 220ESEmpower Semiconductorvia Power delivery chain18chain wt
- 221
Loongson Technology688047.SSvia ASIC17chain wt - 222
Rigaku Holdings Corporation268A.Tvia Yield17chain wt - 223
Primarius Technologies688206.SSvia EDA & design IP17chain wt - 224
JEOL Ltd.6951.Tvia Yield17chain wt - 225
Black Sesame International Holding2533.HKvia ASIC17chain wt - 226AOSLAlpha and Omega SemiconductorAOSLvia Power delivery chain17chain wt
- 227SEV.VSpectra7 Microsystems Inc.SEV.Vvia Scale-up fabric17chain wt
- 228Y(YMTC (Yangtze Memory Technologies)via AI factory17chain wt
- 229
Axelera AIvia ASIC17chain wt - 230SASiMa.aivia ASIC17chain wt
- 231
Imagination Technologiesvia EDA & design IP17chain wt - 232NENextSiliconvia ASIC17chain wt
- 2333036.TWWT Microelectronics Co., Ltd.3036.TWvia Host compute (server CPUs)16chain wt
- 234600641.SSWanye Enterprises (Kingstone Semiconductor)600641.SSvia Foundry capacity16chain wt
- 2353702.TWWPG Holdings Limited3702.TWvia Host compute (server CPUs)16chain wt
- 2363105.TWOWIN Semiconductors Corp.3105.TWOvia Photonic components16chain wt
- 237SITMSiTime CorporationSITMvia Host compute (server CPUs)15chain wt
- 2383529.TWeMemory Technology3529.TWvia EDA & design IP15chain wt
- 239301095.SZSemitronix (Hangzhou Guangli Microelectronics)301095.SZvia Yield15chain wt
- 240BZAIBlaize HoldingsBZAIvia ASIC15chain wt
- 241PRproteanTecsvia Yield15chain wt
- 242
Rockchip Electronics603893.SSvia ASIC14chain wt - 243300567.SZWuhan Jingce Electronic Group300567.SZvia Test & burn-in capacity14chain wt
- 244
InnoScience (Suzhou) Technology2577.HKvia Power delivery chain14chain wt - 245688233.SSThinkon Semiconductor Jinzhou688233.SSvia Foundry capacity14chain wt
- 246
Power IntegrationsPOWIvia Power delivery chain14chain wt - 2476643.TWM31 Technology6643.TWvia EDA & design IP14chain wt
- 248INTTinTEST CorporationINTTvia Test & burn-in capacity14chain wt
- 249FJFujian Jinhua Integrated Circuit (JHICC)via DRAM14chain wt
- 250
Lattice SemiconductorLSCCvia Host compute (server CPUs)13chain wt - 251
ROHM Co., Ltd.6963.Tvia Power delivery chain13chain wt - 252
Silvaco GroupSVCOvia EDA & design IP13chain wt - 253
Iluvatar CoreXvia GPU13chain wt - 254
Phytium Technologyvia Host compute (server CPUs)13chain wt - 255KBKandou Busvia SerDes13chain wt
- 256688627.SSShenzhen SEICHI Technologies (Jingzhida)688627.SSvia DRAM11chain wt
- 257688385.SSShanghai Fudan Microelectronics Group688385.SSvia ASIC11chain wt
- 258CNCornelis Networksvia Scale-out fabric11chain wt
- 259ETEtchedvia ASIC10chain wt
- 260EAEnCharge AIvia ASIC9chain wt
Frequently asked
What are the top ai chip stocks?
By modeled exposure to the AI value chain: NVIDIA, TSMC, ASE Technology Holding Co., Ltd., Ibiden Co., Ltd., Amkor Technology, SK hynix. The full ranked list of 260 names is below.
How are ai chip stocks ranked here?
By chain-weight — each company's exposure to the parts of the AI chain, scaled by how central those parts are and the quality of its role (producer, supplier, consumer). It's a structural read, not a price target.
Which chips company has the most AI-chain exposure?
NVIDIA, most strongly through GPU, with a chain-weight of 88/100.
Chain-weight is an illustrative, order-of-magnitude read from our model of the AI value chain — not investment advice.
as of 2026-07-17Medium confidence model v0.7.0